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[IEEE] Application of High Silicon Aluminum Alloy in the Field of Microelectronic Packaging

李重坤 Post time Yesterday 15:18 | Show all posts |Read mode
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journal：2021 CIE International Conference on Radar (Radar)

Authors：Wang Na; Lei Ou; Zhao Yong; Luo Han Bing; Yang Zhen

Published date：2021-12-15

DOI：10.1109/radar53847.2021.10028646

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10028646

Article link：https://doi.org/10.1109/radar53847.2021.10028646

Article Source：IEEE。


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