[IEEE] Low-Temperature Sintering of Cu Microparticle/CuXO Nanoparticle Composite Pastes for High-Strength Bonding

18cheung Post time Yesterday 20:13 | Show all posts |Read mode
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期刊:2026年国际电子封装与混合键合研讨会(ICEP-HBS)

作者:米泽哲、麻生隆

出版日期:2026年4月14日

DOI:10.23919/icep-hbs69241.2026.11550527

PDF链接:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11550527

文章链接:https://doi.org/10.23919/icep-hbs69241.2026.11550527

文章来源:IEEE


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