[Elsevier] Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles

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journal:Composite Structures

Authors:Feixiang Tang; Siyu He; Xiuming Liu; Fang Dong; Sheng Liu

Published date:2024-11-

DOI:10.1016/j.compstruct.2024.118462

PDF link:https://www.sciencedirect.com/sc ... 263822324005907/pdf

Article link:https://doi.org/10.1016/j.compstruct.2024.118462

Article Source:Elsevier BV


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