[Other] Revealing the effects of particle shape and distribution on the direct wafer-to-wafer bonding dynamics

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journal:Journal of Applied Physics

Authors:Tao He; Wenkai Lu; Zhoulong Xu; Zhouping Yin; Bin Xie; Hao Wu

Published date:2026-8-7

DOI:10.1063/5.0341214

PDF link:https://pubs.aip.org/aip/jap/art ... 303_1_5.0341214.pdf

Article link:https://doi.org/10.1063/5.0341214

Article Source:AIP Publishing


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