[Elsevier] Porous-fin microchannel heat sinks for future micro-electronics cooling |
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Liquid metal manifold microchannel heat sink for ultra-high heat flux cooling
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Numerical study on temperature distribution uniformity and cooling performance of manifold microchannel heat sink
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Porous-fin microchannel heat sinks for future micro-electronics cooling
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Comparative performance analysis of microchannel heat sink with different geometric structures
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