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[Other] J Zhang, F Tian, W Fengyi, et al. Diffusion behavior and reliability of sintered copper on different metallized substrates[J]. Journal of Materials Science, 2026, 61(4): 2604-2621. DOI: 10.1007/s10853-025-12029-4

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[Other] J Zhang, F Tian, W Fengyi, et al. Diffusion behavior and reliability of sintered copper on different metallized substrates[J]. Journal of Materials Science, 2026, 61(4): 2604-2621. DOI: 10.1007/s10853-025-12029-4 Copy