[Elsevier] A novel crack healing and porosity elimination methodology by electropulsing with compression for additively manufactured components

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journalㄩMaterialia

AuthorsㄩSherin Thampi; Devendra Nagpure; Arun Gopinathan; Hariharan Krishnaswamy; Murugaiyan Amirthalingam

Published dateㄩ2026-5-

DOIㄩ10.1016/j.mtla.2026.102739

PDF linkㄩhttps://www.sciencedirect.com/sc ... 589152926000918/pdf

Article linkㄩhttps://doi.org/10.1016/j.mtla.2026.102739

Article SourceㄩElsevier BV﹝


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