[Other] Porous Copper Layer Development by Dynamic Hydrogen Bubble Template for Power Modules Assembling by Thermocompression

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journalㄩECS Meeting Abstracts

AuthorsㄩJonathan Schoenleber; Lucas Chachay; Goulven Janod; Marie-Pierre Gigandet; Jean-Yves Hihn; Remi Daudin; Jean-Michel Missiaen; Didier Bouvard; Yvan Avenas; Rabih Khazaka

Published dateㄩ2023-8-28

DOIㄩ10.1149/ma2023-01221576mtgabs

PDF linkㄩhttps://iopscience.iop.org/article/10.1149/MA2023-01221576mtgabs

Article linkㄩhttps://doi.org/10.1149/ma2023-01221576mtgabs

Article SourceㄩThe Electrochemical Society﹝


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