[Other] Microled-Based Opto-Electronic Co-Packaging for Chip-to-Chip Communications

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journal：Wafer-Level Packaging Symposium

Authors：Max Min; Drew Hallman-Osinski; Chris Pfistner; Bardia Pezeshki; Alex Tselikov; Cameron Danesh; Emad Afifi; Jerry Ma; Rob Kalman

Published date：2022-2-

DOI：10.37665/watkchj44579

PDF link：https://smta.kglmeridian.com/vie ... le-waTKCHJ44579.xml

Article link：https://doi.org/10.37665/watkchj44579

Article Source：Surface Mount Technology Association。

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