[Other] Thermal Efficiency Evaluation after Thermocompression of Copper Layer Obtained By Dynamic Hydrogen Bubble

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journalㄩECS Meeting Abstracts

AuthorsㄩJonathan Schoenleber; Goulven Janod; Lucas Chachay; Marie-Pierre Gigandet; Yvan Avenas; Remi Daudin; jean-Michel Missiaen; Didier Bouvard; Rabih Khazaka; Jean-Yves Hihn

Published dateㄩ2023-12-22

DOIㄩ10.1149/ma2023-02201210mtgabs

PDF linkㄩhttps://iopscience.iop.org/article/10.1149/MA2023-02201210mtgabs

Article linkㄩhttps://doi.org/10.1149/ma2023-02201210mtgabs

Article SourceㄩThe Electrochemical Society﹝


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