[Other] Power Modules Assembling By Thermocompression of Copper Layer Obtained by Dynamic Hydrogen Bubble: Elaboration Sequences and Electrical Efficiency

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journalㄩECS Meeting Abstracts

AuthorsㄩGoulven Janod; Jonathan Schoenleber; Lucas Chachay; Marie-Pierre Gigandet; Vanessa Avramovic; Jean-Yves Hihn; Yvan Avenas; Remi Daudin; Jean-Michel Missiaen; Didier Bouvard; Rabih Khazaka

Published dateㄩ2024-11-22

DOIㄩ10.1149/ma2024-02221876mtgabs

PDF linkㄩhttps://iopscience.iop.org/article/10.1149/MA2024-02221876mtgabs

Article linkㄩhttps://doi.org/10.1149/ma2024-02221876mtgabs

Article SourceㄩThe Electrochemical Society﹝


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