[Elsevier] Interfacial thermal stress relief in Ag每SnO2 composites by in situ formation of CuO nanoparticles additive on SnO2

Sweetums33 Post time 1 hour(s) ago | Show all posts |Read mode
This post will be closed automatically in 2026-10-19 06:02
Reward100points

journalㄩCeramics International

AuthorsㄩXinlei Han; Zhe Wang; Guijing Li; Wenjie Feng; Xueqian Fang

Published dateㄩ2022-6-

DOIㄩ10.1016/j.ceramint.2022.02.209

PDF linkㄩhttps://www.sciencedirect.com/sc ... 272884222006289/pdf

Article linkㄩhttps://doi.org/10.1016/j.ceramint.2022.02.209



Article SourceㄩElsevier BV﹝



Remarkㄩ
  Please don't upload any wrong document

Best Answer

Please approve

View Full Content

Reply

Use magic Donate Report

All Reply1 Show all posts
minhminh97 Post time 1 hour(s) ago | Show all posts

This post has been completed

Completed attachments will be deleted within 24 hours.
Reply

Use magic Donate Report

Return to the list