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[IEEE] Indium-capped Copper Pillar Flip-chip Scheme Compatible for 2.5D Superconducting Quantum Computing Architecture

yanglina Post time 2026-10-16 15:33:45 | Show all posts |Read mode
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journalㄩ2026 27th International Conference on Electronic Packaging Technology (ICEPT)

AuthorsㄩKaixiang Mao; Jiexun Yu; Qian Wang; Yongbo Wu; Jian Cai

Published dateㄩ2026-8-

DOIㄩ10.1109/icept71373.2026.11690296

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11690296

Article linkㄩhttps://doi.org/10.1109/icept71373.2026.11690296

Article SourceㄩIEEE﹝


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