A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET

Post time 2026-10-18 17:30:37

journal：IEEE Journal of Solid-State Circuits

Authors：Didem Turker Melek; James Vandersand; R. Navin Kumar; Pyare M. Sarkar; Prakash BS; Adrian Leuciuc; Kevin Geary; Shaojun Ma; Chirag M. Mehta; Basant Bothra; Shashi Jain; Pawan Sabharwal; Ranjan Vaish; Kirti Bhanushali; Yutong Ding; Craig Frost; John Annunziata; Krishanu Sadhu; Dimitris Kyritsis; Jeff Bostak; Ming Li; Steve Williams; Ken Chang

Published date：2026-7-

DOI：10.1109/jssc.2026.3651425

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11392685

Article link：https://doi.org/10.1109/jssc.2026.3651425

Article Source：Institute of Electrical and Electronics Engineers (IEEE)。

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Post time 2026-10-18 17:30:38

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[IEEE] A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET

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[IEEE] A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET Copy

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[IEEE] A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET