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[IOP] Stress analysis and characterization of TEOS-based PECVD fabricated SiO2 solid films after thermal annealing

dailu-1997 Post time 5 day(s) ago | Show all posts |Read mode
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journalㄩSemiconductor Science and Technology

AuthorsㄩKun Zhang; Jun Chen; Xiaomin Cheng; Xiangshui Miao; Zhiliang Xia

Published dateㄩ2025-9-30

DOIㄩ10.1088/1361-6641/ae0516

PDF linkㄩhttps://iopscience.iop.org/article/10.1088/1361-6641/ae0516

Article linkㄩhttps://doi.org/10.1088/1361-6641/ae0516

Article SourceㄩIOP Publishing﹝


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