A Transient CFD Study on Implementation of Dynamic Liquid Cooling for Series and Parallel Arrangement of Components in a Server at Rack Level

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journal：2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

Authors：Himanshu Modi; Pardeep Shahi; Vibin Shalom; Lochan Sai Reddy Chintaparthy; Dereje Agonafer

Published date：2023-3-13

DOI：10.23919/semi-therm59981.2023.10267884

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10267884

Article link：https://doi.org/10.23919/semi-therm59981.2023.10267884

Article Source：IEEE。

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[IEEE] A Transient CFD Study on Implementation of Dynamic Liquid Cooling for Series and Parallel Arrangement of Components in a Server at Rack Level

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