[IEEE] Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

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journalㄩIEEE Transactions on Components, Packaging and Manufacturing Technology

AuthorsㄩXiaofan Jia; Xingchen Li; Serhat Erdogan; Kyoung-Sik Moon; Joon Woo Kim; Kai-Qi Huang; Matthew B. Jordan; Madhavan Swaminathan

Published dateㄩ2023-2-

DOIㄩ10.1109/tcpmt.2023.3251725

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10057443

Article linkㄩhttps://doi.org/10.1109/tcpmt.2023.3251725

Article SourceㄩInstitute of Electrical and Electronics Engineers (IEEE)﹝


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