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[IEEE] Investigation of Post-Bonding Die Stretching in Die-to-Wafer Hybrid Bonding

sunscale Post time 1 hour(s) ago | Show all posts |Read mode
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journalㄩ2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

AuthorsㄩYinan Lu; Benedikt Pressl; Ke Zheng; Liu Jiang; Ying W Wang; Hannes Kostner; Chris Scanlan; Raymond Hung; El Mehdi Bazizi

Published dateㄩ2025-6-8

DOIㄩ10.23919/vlsitechnologyandcir65189.2025.11074786

PDF linkㄩhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11074786

Article linkㄩhttps://doi.org/10.23919/vlsitechnologyandcir65189.2025.11074786

Article SourceㄩIEEE﹝


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tarak-dhaouadi Post time 1 hour(s) ago | Show all posts

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