Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

Post time Half hour(s) ago

journal：IEEE Transactions on Components and Packaging Technologies

Authors：D.A. Hutt; C. Liu; P.P. Conway; D.C. Whalley; S.H. Mannan

Published date：2002-3-

DOI：10.1109/6144.991180

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=991180

Article link：https://doi.org/10.1109/6144.991180

Article Source：Institute of Electrical and Electronics Engineers (IEEE)。

Remark：

Post time Half hour(s) ago

: This post has been completed
Completed attachments will be deleted within 24 hours.

[IEEE] Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

Best Answer

Same Category

Latest Reply

Announcement

Daily Top Contributors

[IEEE] Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation Copy

Best Answer

Same Category

Latest Reply

Announcement

Daily Top Contributors

[IEEE] Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation