[Elsevier] The physical improvement of copper deposition uniformity with the simulation models

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journal：Journal of Electroanalytical Chemistry

Authors：Chun-Wei Ma; Shun-Hsuan Yu; Jen-Kuang Fang; Ping-Feng Yang; Hou-Chien Chang

Published date：2023-11-

DOI：10.1016/j.jelechem.2023.117790

PDF link：https://www.sciencedirect.com/sc ... 572665723006501/pdf

Article link：https://doi.org/10.1016/j.jelechem.2023.117790

Article Source：Elsevier BV。

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[Elsevier] The physical improvement of copper deposition uniformity with the simulation models Copy