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[Elsevier] The physical improvement of copper deposition uniformity with the simulation models

amir-1998 Post time 1 hour(s) ago | Show all posts |Read mode
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journalㄩJournal of Electroanalytical Chemistry

AuthorsㄩChun-Wei Ma; Shun-Hsuan Yu; Jen-Kuang Fang; Ping-Feng Yang; Hou-Chien Chang

Published dateㄩ2023-11-

DOIㄩ10.1016/j.jelechem.2023.117790

PDF linkㄩhttps://www.sciencedirect.com/sc ... 572665723006501/pdf

Article linkㄩhttps://doi.org/10.1016/j.jelechem.2023.117790

Article SourceㄩElsevier BV﹝


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