[Other] 2D Strain Analysis of Printed Circuit Boards Under Vertical Vibration Loads During Truck Transport

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journalㄩASME 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

AuthorsㄩAmin Joodaky; Saeid Ansari; Mayank Jain; Reza Najafi; Mojtaba Safari; Fazle Rabbi

Published dateㄩ2025-10-28

DOIㄩ10.1115/ipack2025-169114

PDF linkㄩhttps://asmedigitalcollection.as ... pack2025-169114.pdf

Article linkㄩhttps://doi.org/10.1115/ipack2025-169114

Article SourceㄩAmerican Society of Mechanical Engineers﹝


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