[IEEE] Design and Demonstration of 3D-Stacked Packaging SiC Power Module with Low Parasitic Inductance and Low Thermal Resistance |
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Analysis of Synchrophasor Measurements with Artificial Intelligence Techniques
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Design of Dual-Mode X-Band Reflectarray for Defense Communication
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A Floating-Point CIM Macro Featuring Asymmetric Exponent Encoding and Adaptive Mantissa Truncation for High-Efficiency AI Edge Computing
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Image Fusion Based on Prior Information
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IEEE 2800 P2800.2/D4.1, Nov 2025
