[Other] Reduction of Metal Contaminants Level on the Silicon Wafer Surface Using Chemical Additive during Chemical Mechanical Polishing

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期刊:ECS会议摘要

作者:Hao Cui; Jea-Gun Park; JinHyung Park; Sangsu Yun; Eun-bin Seo

发表日期:2014年4月1日

DOI:10.1149/ma2014-01/38/1437

PDF链接:https://iopscience.iop.org/article/10.1149/MA2014-01/38/1437

文章链接:https://doi.org/10.1149/ma2014-01/38/1437

文章来源:电化学学会


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