[ACS] Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging

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journal:ACS Applied Materials & Interfaces

Authors:Chungen Hsu; Chenlei Pang; Qinghua Lu; Seongku Kim

Published date:--

DOI:10.1021/acsami.6c09651

PDF link:https://pubs.acs.org/doi/pdf/10.1021/acsami.6c09651

Article link:https://doi.org/10.1021/acsami.6c09651

Article Source:American Chemical Society (ACS)


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