[Elsevier] Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition

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journal：Microelectronics Reliability

Authors：G. Janod; L. Chachay; J. Schoenleber; Y. Avenas; D. Bouvard; R. Daudin; J.-M. Missiaen; M.-P. Gigandet; J.-Y. Hihn; R. Khazaka

Published date：2025-4-

DOI：10.1016/j.microrel.2025.115648

PDF link：https://www.sciencedirect.com/sc ... 026271425000617/pdf

Article link：https://doi.org/10.1016/j.microrel.2025.115648

Article Source：Elsevier BV。

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