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J Zhang, F Tian, W Fengyi, et al. Diffusion behavior and reliability of sintered copper on different metallized substrates[J]. Journal of Materials Science, 2026, 61(4): 2604-2621. DOI: 10.1007/s10853-025-12029-4
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Huang, S., Li, M., & Ding, Z. (2026). In-situ reduction enabled anti-oxidation sintering of copper paste in air for power module packaging. Materials
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Chen, G., Yu, S., & Duan, L. (2026). Low-temperature sinterable copper paste with a flake-spherical hybrid network and enhanced anti-oxidation properties. Journal of Materials ＃. https://doi.org/10.1007/s10853-026-12712-0
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FraSNA-Net: traffic aware content caching vehicular social networks using fractional shuffle neuron attention network
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Isometric Trunk Strength Assessment of Athletes: Effects of Sex, Sport, and Low Back Pain History
