[Other] An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

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journalㄩJournal of Electronic Packaging

AuthorsㄩAnil Yuksel; Vic Mahaney; Chris Marroquin; Shurong Tian; Mark Hoffmeyer; Mark Schultz; Todd Takken

Published dateㄩ2021-3-1

DOIㄩ10.1115/1.4046847

PDF linkㄩhttp://asmedigitalcollection.asm ... p_143_01_011005.pdf

Article linkㄩhttps://doi.org/10.1115/1.4046847

Article SourceㄩASME International﹝


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