Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging

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journal：2023 IEEE CPMT Symposium Japan (ICSJ)

Authors：Christian Hofmann; Patrick Rochala; Martin Kroll; Sushant Panhale; Mario Baum; Harald Kuhn; Kiyoshi Oi; Masaki Sanada; Kei Murayama

Published date：2023-11-15

DOI：10.1109/icsj59341.2023.10339581

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10339581

Article link：https://doi.org/10.1109/icsj59341.2023.10339581

Article Source：IEEE。

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